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AMD Mobile Serial VID Dual-Phase
Fixed-Frequency Controller
I RMS = ? OUT 1 ? I OUT 1 ( I OUT 1 ? I IN ) + ? OUT 2 ? I OUT 2 ( I OUT 2 ? I IN )
I IN = ? OUT 1 ? I OUT 1 + ? OUT 2 ? I OUT 2
When using low-capacity ceramic-filter capacitors,
capacitor size is usually determined by the capacity
needed to prevent V SOAR from causing problems during
load transients. Generally, once enough capacitance is
added to meet the overshoot requirement, undershoot at
the rising load edge is no longer a problem.
Input-Capacitor Selection
The input capacitor must meet the ripple-current
requirement (I RMS ) imposed by the switching currents.
For a dual, 180° interleaved controller, the out-of-phase
operation reduces the RMS input ripple current, effec-
tively lowering the input capacitance requirements.
When both outputs operate with a duty cycle less than
50% (V IN > 2 x V OUT ), the RMS input-ripple current is
defined by the following equation:
? V ? ? V ?
? V IN ? ? V IN ?
where I IN is the average input current:
? V ? ? V ?
? V IN ? ? V IN ?
In combined mode (GNDS2 = V DDIO ) with both phases
active, the input RMS current simplifies to:
selected current-sense resistor value or inductor DCR,
and allows smaller current-sense resistance to be
used, reducing the overall power dissipated.
Steady-State Voltage Positioning
Connect a resistor (R FBDC_ ) between FBDC_ and the
remote-sense point to set the steady-state DC droop
(load line) based on the required voltage-positioning
slope (R DROOPDC ):
R FBDC_ = R DROOPDC / (R SENSE_ x G m(FBDC_) )
where R DROOPDC is the desired steady-state droop,
G m(FBDC_) is typically 1ms as defined in the Electrical
Characteristics table, and R SENSE_ is the value of the
current-sense resistor that is used to provide the
(CSP_, CSN_) current-sense voltage.
When the inductors’ DCR is used as the current-sense
element (R SENSE = R DCR ), the inductor DCR circuit
should include an NTC thermistor to cancel the temper-
ature dependence of the inductor DCR, maintaining a
constant voltage-positioning slope.
Transient Droop
Connect a resistor (R FBAC_ ) between FBAC_ and the
remote-sense point to set the DC transient AC droop
(load-line) based on the required voltage-positioning
slope (R DROOPAC ):
I RMS = I OUT ? OUT ? ?
? OUT ?
? V ? ? 1
? V IN ? ? 2
V ?
V IN ?
R FBAC_ = R DROOPAC / (R SENSE_ x G m(FBAC_) )
where R DROOPAC is the desired steady-state droop,
G m(FBAC_) is typically 1mS as defined in the Electrical
For most applications, nontantalum chemistries (ceramic,
aluminum, or OS-CON) are preferred due to their resis-
tance to inrush surge currents typical of systems with a
mechanical switch or connector in series with the input.
If the MAX17009 is operated as the second stage of a
two-stage power-conversion system, tantalum input
capacitors are acceptable. In either configuration,
choose an input capacitor that exhibits less than 10°C
temperature rise at the RMS input current for optimal
circuit longevity.
Voltage Positioning and
Loop Compensation
Voltage positioning dynamically lowers the output volt-
age in response to the load current, reducing the out-
put capacitance and processor ’s power-dissipation
requirements. The controller uses two transconduc-
tance amplifiers to set the transient and DC output-volt-
age droop (Figure 3). The transient-compensation
(TRC) amplifier determines how quickly the MAX17009
responds to the load transient. The FBDC_ amplifier
adjusts the steady-state regulation voltage as a func-
tion of the load. This adjustability allows flexibility in the
Characteristics table, and R SENSE_ is the value of the
current-sense resistor that is used to provide the
(CSP_, CSN_) current-sense voltage.
When the inductors’ DCR is used as the current-sense
element (R SENSE = R DCR ), the inductor DCR circuit
should include an NTC thermistor to cancel the temper-
ature dependence of the inductor DCR, maintaining a
constant voltage-positioning slope.
Power-MOSFET Selection
Most of the following MOSFET guidelines focus on the
challenge of obtaining high load-current capability
when using high-voltage (> 20V) AC adapters. Low-
current applications usually require less attention.
The high-side MOSFET (N H ) must be able to dissipate
the resistive losses plus the switching losses at both
V IN(MIN) and V IN(MAX) . Calculate both these sums.
Ideally, the losses at V IN(MIN) should be roughly equal to
losses at V IN(MAX) , with lower losses in between. If the
losses at V IN(MIN) are significantly higher than the losses
at V IN(MAX) , consider increasing the size of N H (reducing
R DS(ON) but with higher C GATE ). Conversely, if the losses
at V IN(MAX) are significantly higher than the losses at
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